Leaked Photos Show Blue iPhone 7 Plus, iPhone 7 Logic Board

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For some time they have been listening, or rather reading, rumors about a new range of colors that could star in the upcoming Apple terminal. Now, on the Web appear  again, several images of the iPhone 7 in a color never seen before: deep blue.

With less than a month for Apple present the new iPhone 2016, there are already a lot of leaks of high quality showing both the iPhone 7 and iPhone 7 Plus and more than possible iPhone 7 Pro. The vast majority of these leaks do not present anything new, but today received images iPhone 7 with a feature that has never been seen before.



According to a MacRumors that analyzed both phones, the iPhone 6s logic boards with those alleged iPhone 7, Apple’s new smartphone could mount an Intel modem, exactly as suggested in the past by different rumors.

By comparing the two cards, MacRumors has discovered that first of iPhone 7 there will be a Qualcomm baseband, replaced by an Intel modem. Indeed, an analysis was conducted on a single iPhone logic board 7 and for now it is not possible to exclude that Apple may have nonetheless commissioned the supply of some Qualcomm baseband too, just as happened with the processors (TSMC, Samsung) of the iPhone 6s.


MacRumors image we can also note the points where the various iPhone chip should be set 7. It may also be noted small absences and changes to the card, for example, it seems to be completely missing the 5 Intel SMARTi RF accompanying the Intel model. Grows in size, on the logic board, the portion dedicated to audio amplifiers and drums. The processor A10, finally, seems to maintain the same size of the iPhone 6s and iPhone 6s Plus  A9 chip.


Comparison of bottom rear portion of iPhone 6s (left) and iPhone 7 (right) logic boards

Intel seems to be reserved for the figure above baseband fillet (suspected on the official website of the size of Intel’s XMM 7360), because it varies widely Qualcomm’s MDM9635 (refer to iFixit disassembled the iPhone 6s bare board).

Rear near the bottom of the transceiver, we have seen a lot of changes. Such as a metal band RF isolation and audio / cell components from a horizontal into a vertical direction, audio amplifier and battery charging area has increased.

Finally, A10 SoC behavior has a space (A9, too) in the four sides, we usually on (such as a desktop CPU) to see a larger chip, which is mainly for power supply and signal separated from the core.
Of course, doing so also brings some compromises, such as though the core A9 A8 size smaller than the point, but the package size and a disadvantage. A9 and A10 should follow the same 16nm FinFET process, but optimized properly, increase the transistor will not bring major changes on the package size.

(Source: tech.infeng [Google Translate], Weibo | Via: MacRumors)

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