TSMC to use Fingerprint Sensor for iPhone 6

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sensoriPhone sold tens of millions of units per quarter , so any change in the process of manufacturing components can influence the situation with the availability of smartphones in the store – this is especially critical at the stage of the launch of new models. According to rumors, the deficit of fingerprint scanners Touch ID has caused enough of rapid increases in iPhone 5s release last fall.

Some time ago it was reported that Taiwan Semiconductor Manufacturing Company (TSMC) plans to move production of biometric sensors to Apple for businesses using silicon wafer size of 300 mm instead of the existing 200 mm.

TSMC itself should be engaged in the technological package of sensors, whereas now this operation is performed subcontractors . As it became known , at the insistence of the company Apple has decided to keep production at its plants sensors using silicon wafers 200 mm size .

The problem is that the level of product yield using the 300 mm wafer size below ( 70-80 % ) than in the case with the plates of 200 mm size ( 95 %). Packaging operation will continue to engage subcontractors .

Considering not a good experience with the launch of production of sensors that detect the user fingerprint , Apple chose to choose a reliable and trusted option. I would like to believe that it will help iPhone 6 appear on the market in time. Especially because sensors Touch ID of the second generation will be performed using an advanced 65nm process , improves the efficiency and reliability of the fingerprint reader .

According to rumors, Apple supplier plans to start production of new sensors Touch ID in the second quarter .

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